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BAT46WJ,115 Технические параметры
Nexperia USA Inc. BAT46WJ,115 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Diodes - Rectifiers - Single | |
| Марка | ||
| Factory Lead Time | 4 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-90, SOD-323F | |
| Surface Mount | YES | |
| Number of Pins | 2Pins | |
| Diode Element Material | SILICON | |
| Number of Elements | 1 Element | |
| Power Dissipation (Max) | 0.4W | |
| Packaging | Tape & Reel (TR) | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin (Sn) | |
| HTS Code | 8541.10.00.70 | |
| Terminal Position | DUAL | |
| Terminal Form | FLAT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Base Part Number | BAT46WJ | |
| Pin Count | 2 | |
| Reference Standard | AEC-Q101; IEC-60134 | |
| Qualification Status | Not Qualified | |
| Configuration | SINGLE | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Diode Type | Schottky | |
| Current - Reverse Leakage @ Vr | 9μA @ 100V | |
| Voltage - Forward (Vf) (Max) @ If | 850mV @ 250mA | |
| Forward Current | 250mA | |
| Operating Temperature - Junction | 150°C Max | |
| Current - Average Rectified (Io) | 250mA DC | |
| Reverse Recovery Time | 5.9ns | |
| Peak Reverse Current | 4μA | |
| Max Repetitive Reverse Voltage (Vrrm) | 100V | |
| Capacitance @ Vr, F | 39pF @ 0V 1MHz | |
| Reverse Voltage | 100V | |
| Max Forward Surge Current (Ifsm) | 2.5A | |
| Max Junction Temperature (Tj) | 150°C | |
| Ambient Temperature Range High | 150°C | |
| Height | 800μm | |
| RoHS Status | ROHS3 Compliant |
BAT46WJ,115 Документы
- DatasheetsBAT46WJ
- PCN Design/SpecificationBond Wiring Chg 06/Sep/2015 SOD323F Bond Wire Au to Cu & 2nd Source Mold Comp 2/Nov/2015
- PCN Assembly/OriginMult Dev Wafer Fab Chg 1/Jan/2019
- PCN PackagingLighter Reels 02/Jan/2014 Pack/Label Update 30/Nov/2016
- RohsStatementNXP-Semiconductors-company-12.pdf
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