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BC69PA,115 Технические параметры
Nexperia USA Inc. BC69PA,115 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Transistors - Bipolar (BJT) - Single | |
| Марка | ||
| Factory Lead Time | 8 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 3-PowerUDFN | |
| Number of Pins | 3Pins | |
| Transistor Element Material | SILICON | |
| Collector-Emitter Breakdown Voltage | 20V | |
| Number of Elements | 1 Element | |
| Operating Temperature | 150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Published | 2011 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 3Terminations | |
| ECCN Code | EAR99 | |
| Max Power Dissipation | 420mW | |
| Terminal Position | DUAL | |
| Terminal Form | NO LEAD |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Peak Reflow Temperature (Cel) | 260 | |
| Frequency | 140MHz | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Pin Count | 3 | |
| Configuration | SINGLE | |
| Power Dissipation | 1.65W | |
| Case Connection | COLLECTOR | |
| Power - Max | 420mW | |
| Transistor Application | SWITCHING | |
| Polarity/Channel Type | PNP | |
| Transistor Type | PNP | |
| Collector Emitter Voltage (VCEO) | 20V | |
| Max Collector Current | 2A | |
| DC Current Gain (hFE) (Min) @ Ic, Vce | 85 @ 500mA 1V | |
| Current - Collector Cutoff (Max) | 100nA ICBO | |
| Vce Saturation (Max) @ Ib, Ic | 600mV @ 200mA, 2A | |
| Transition Frequency | 140MHz | |
| Max Breakdown Voltage | 20V | |
| Collector Base Voltage (VCBO) | 32V | |
| Emitter Base Voltage (VEBO) | 5V | |
| RoHS Status | ROHS3 Compliant |
BC69PA,115 Документы
- DatasheetsBCP69, BC869, BC69PA BC69PA%2C115-Nexperia-datasheet-87580927.pdf BC69PA%2C115-Philips-datasheet-11533691.pdf
- PCN Design/SpecificationMaterial Chg 14/Feb/2016 DFN2020-yy Series Assembly Materials Chg 17/Apr/2016
- PCN PackagingLogo 10/Dec/2016 Label Chg 12/Mar/2017
- RohsStatementNXP-Semiconductors-company-12.pdf
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