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- BZA456A,115
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BZA456A,115 Технические параметры
Nexperia USA Inc. BZA456A,115 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | TVS - Diodes | |
| Марка | ||
| Factory Lead Time | 4 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-74, SOT-457 | |
| Number of Pins | 6Pins | |
| Diode Element Material | SILICON | |
| Breakdown Voltage / V | 5.32V | |
| Number of Elements | 4 Elements | |
| Reverse Stand-off Voltage | 5.6V | |
| Operating Temperature | -65°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Published | 1999 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| Termination | SMD/SMT | |
| ECCN Code | EAR99 | |
| Type | Zener | |
| Applications | General Purpose | |
| Capacitance | 240pF | |
| Max Power Dissipation | 24W | |
| Terminal Position | DUAL |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Depth | 1.7mm | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | BZA4*A | |
| Pin Count | 6 | |
| Operating Supply Voltage | 5.88V | |
| Polarity | Unidirectional | |
| Leakage Current | 2μA | |
| Element Configuration | Common Anode | |
| Power Line Protection | No | |
| Current - Peak Pulse (10/1000μs) | 3A 8/20μs | |
| Max Reverse Leakage Current | 2μA | |
| Clamping Voltage | 8V | |
| Voltage - Reverse Standoff (Typ) | 5.6V | |
| Peak Pulse Current | 3A | |
| Max Surge Current | 3A | |
| Peak Pulse Power | 24W | |
| Capacitance @ Frequency | 240pF @ 1MHz | |
| ESD Protection | Yes | |
| Number of Unidirectional Channels | 4Unidirectional Channels | |
| Height | 1mm | |
| Length | 3.1mm | |
| Width | 1.7mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
BZA456A,115 Документы
- PCN PackagingLogo 10/Dec/2016 Label Chg 12/Mar/2017
- DatasheetsBZA456A
- ReachStatementNXP-Semiconductors-company-13.pdf
- PCN Design/SpecificationResin Hardener 02/Jul/2013
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