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- MMBZ9V1AL,215
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MMBZ9V1AL,215 Технические параметры
Nexperia USA Inc. MMBZ9V1AL,215 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | TVS - Diodes | |
| Марка | ||
| Factory Lead Time | 4 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Number of Pins | 3Pins | |
| Diode Element Material | SILICON | |
| Breakdown Voltage / V | 8.65V | |
| Number of Elements | 2 Elements | |
| Reverse Stand-off Voltage | 6V | |
| Operating Temperature | -55°C~150°C TA | |
| Packaging | Tape & Reel (TR) | |
| Series | Automotive, AEC-Q101 | |
| Published | 2009 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 3Terminations | |
| Termination | Solder | |
| ECCN Code | EAR99 | |
| Type | Zener | |
| Applications | Automotive | |
| Capacitance | 200pF | |
| Max Power Dissipation | 24W | |
| Terminal Position | DUAL |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Depth | 1.4mm | |
| Current Rating | 1.7A | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | MMBZ | |
| Pin Count | 3 | |
| Operating Supply Voltage | 900mV | |
| Working Voltage | 6V | |
| Polarity | Unidirectional | |
| Number of Channels | 1Channel | |
| Leakage Current | 100nA | |
| Power Line Protection | No | |
| Clamping Voltage | 14V | |
| Voltage - Reverse Standoff (Typ) | 6V Max | |
| Peak Pulse Current | 1.7A | |
| Peak Pulse Power | 24W | |
| Direction | Bidirectional | |
| Unidirectional Channels | 2 | |
| Bidirectional Channels | 1 | |
| Rep Pk Reverse Voltage-Max | 6V | |
| Capacitance @ Frequency | 155pF @ 1MHz | |
| Max Breakdown Voltage | 9.56V | |
| Length | 3mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
MMBZ9V1AL,215 Документы
- PCN PackagingLogo 10/Dec/2016 Label Chg 12/Mar/2017
- DatasheetsMMBZzzzAL
- PCN Design/SpecificationCopper Bond Wire 02/Sep/2013 Resin Hardener 02/Jul/2013
- ReachStatementNXP-Semiconductors-company-13.pdf
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