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- PESD5V0S1BA,115
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PESD5V0S1BA,115 Технические параметры
Nexperia USA Inc. PESD5V0S1BA,115 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | TVS - Diodes | |
| Марка | ||
| Factory Lead Time | 4 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-76, SOD-323 | |
| Surface Mount | YES | |
| Number of Pins | 2Pins | |
| Diode Element Material | SILICON | |
| Number of Elements | 1 Element | |
| Breakdown Voltage / V | 5.5V | |
| Operating Temperature | -65°C~150°C TA | |
| Packaging | Tape & Reel (TR) | |
| Published | 2009 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| ECCN Code | EAR99 | |
| Type | Zener | |
| Terminal Finish | Tin (Sn) | |
| Applications | General Purpose | |
| Additional Feature | LOW CAPACITANCE |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Capacitance | 35pF | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | PESD*S1B | |
| Pin Count | 2 | |
| Operating Supply Voltage | 5V | |
| Configuration | SINGLE | |
| Power Line Protection | No | |
| Power - Peak Pulse | 130W | |
| Current - Peak Pulse (10/1000μs) | 12A 8/20μs | |
| Voltage - Clamping (Max) @ Ipp | 14V | |
| Voltage - Reverse Standoff (Typ) | 5V Max | |
| Direction | Bidirectional | |
| Bidirectional Channels | 1 | |
| Rep Pk Reverse Voltage-Max | 5V | |
| Capacitance @ Frequency | 35pF @ 1MHz | |
| Max Junction Temperature (Tj) | 150°C | |
| Ambient Temperature Range High | 150°C | |
| Height | 1.1mm | |
| RoHS Status | ROHS3 Compliant |
PESD5V0S1BA,115 Документы
- DatasheetsPESD5V0S1Bx Datasheet
- PCN Design/SpecificationCopper Bond Wire 26/Oct/2013 Wafer Design Chg 13/Jun/2016
- PCN PackagingLighter Reels 02/Jan/2014 Label Chg 12/Mar/2017
- RohsStatementNXP-Semiconductors-company-12.pdf
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