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BGA3031 Технические параметры

NXP  BGA3031 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация RF Amplifiers
Марка NXP
Package / Case 1210 (3225 Metric)
Surface Mount YES
Supplier Device Package 1210
Number of Terminals 20Terminals
Package Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
Base Product Number RN73H2E
Mfr KOA Speer Electronics, Inc.
Product Status Active
Package Description 5 X 5 MM, 0.85 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MO-220, SOT662-1, HVQFN-20
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Package Body Material PLASTIC/EPOXY
Manufacturer Part Number BGA3031
Package Code HVQCCN
Package Shape SQUARE
Manufacturer NXP Semiconductors
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Risk Rank 5.58
Operating Temperature -55°C ~ 155°C
Series RN73H
Свойство продукта Значение свойства
Size / Dimension 0.126 L x 0.098 W (3.20mm x 2.50mm)
Tolerance ±0.1%
Number of Terminations 2Terminations
Temperature Coefficient ±25ppm/°C
Resistance 4.32 kOhms
Composition Metal Film
Power (Watts) 0.25W, 1/4W
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Number of Functions 1Function
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
JESD-30 Code S-PQCC-N20
Failure Rate -
Seated Height-Max 1 mm
Consumer IC Type CONSUMER CIRCUIT
Features Automotive AEC-Q200, Moisture Resistant
Height Seated (Max) 0.028 (0.70mm)
Width 5 mm
Length 5 mm
Ratings AEC-Q200
Просмотр сходства
BGA3031 brand manufacturers: NXP, Anli stock, BGA3031 reference price.NXP. BGA3031 parameters, BGA3031 Datasheet PDF and pin diagram description download.You can use the BGA3031 RF Amplifiers, DSP Datesheet PDF, find BGA3031 pin diagram and circuit diagram and usage method of function,BGA3031 electronics tutorials.You can download from the Anli.