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BLF6G22LS-180RN Технические параметры

NXP  BLF6G22LS-180RN technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Transistors - FETs, MOSFETs - RF
Марка NXP
Mounting Type Surface Mount, MLCC
Package / Case 1206 (3216 Metric)
Surface Mount YES
Number of Terminals 2Terminals
Transistor Element Material SILICON
Package Tape & Reel (TR)
Mfr Vishay Vitramon
Product Status Obsolete
Voltage Rated 200V
Package Description FLATPACK, R-CDFP-F2
Package Style FLATPACK
Package Body Material CERAMIC, METAL-SEALED COFIRED
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 225 °C
Rohs Code Yes
Manufacturer Part Number BLF6G22LS-180RN
Package Shape RECTANGULAR
Manufacturer NXP Semiconductors
Number of Elements 1 Element
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Risk Rank 5.8
Drain Current-Max (ID) 49 A
Operating Temperature -55°C ~ 150°C
Series GA
Size / Dimension 0.126 L x 0.063 W (3.20mm x 1.60mm)
Свойство продукта Значение свойства
Tolerance ±0.5pF
Pbfree Code Yes
ECCN Code EAR99
Temperature Coefficient C0G, NP0
Applications Automotive
Capacitance 1.8 pF
Terminal Position DUAL
Terminal Form FLAT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
Pin Count 2
JESD-30 Code R-CDFP-F2
Qualification Status Not Qualified
Failure Rate -
Lead Spacing -
Configuration SINGLE
Operating Mode ENHANCEMENT MODE
Lead Style -
Case Connection SOURCE
Transistor Application AMPLIFIER
Polarity/Channel Type N-CHANNEL
DS Breakdown Voltage-Min 65 V
FET Technology METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band S BAND
Features -
Height Seated (Max) -
Thickness (Max) 0.067 (1.70mm)
Ratings AEC-Q200
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