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BZB784-C12+115 Технические параметры

NXP  BZB784-C12+115 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Diodes - Zener - Arrays
Марка NXP
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SC-70, SOT-323
Number of Pins 70Pins
Supplier Device Package SOT-323
Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Blue Anodized
RoHS Compliant
Package Bulk
Impedance (Max) (Zzt) 25 Ohms
Mfr NXP USA Inc.
Product Status Active
Series pushPIN™
Operating Temperature -
Tolerance 5 %
Part Status Active
Type Top Mount
Max Operating Temperature 150 °C
Min Operating Temperature -65 °C
Свойство продукта Значение свойства
Max Power Dissipation 180 mW
Configuration 1 Pair Common Anode
Attachment Method Push Pin
Height Off Base (Height of Fin) 0.984 (25.00mm)
Thermal Resistance @ Forced Air Flow 4.24°C/W @ 100 LFM
Impedance 25 Ω
Element Configuration Common Anode
Current - Reverse Leakage @ Vr 100 nA @ 8 V
Power Dissipation 350 mW
Voltage - Forward (Vf) (Max) @ If 900 mV @ 10 mA
Power - Max 180 mW
Max Reverse Leakage Current 100 nA
Test Current 5 mA
Voltage - Zener (Nom) (Vz) 12 V
Zener Voltage 12.05 V
Voltage Tolerance 5 %
ESD Protection Yes
Thermal Resistance @ Natural --
Power Dissipation @ Temperature Rise --
Width 1.575 (40.00mm)
Length 1.575 (40.00mm)
Diameter --
Radiation Hardening No
Просмотр сходства
BZB784-C12+115 brand manufacturers: NXP, Anli stock, BZB784-C12+115 reference price.NXP. BZB784-C12+115 parameters, BZB784-C12+115 Datasheet PDF and pin diagram description download.You can use the BZB784-C12+115 Diodes - Zener - Arrays, DSP Datesheet PDF, find BZB784-C12+115 pin diagram and circuit diagram and usage method of function,BZB784-C12+115 electronics tutorials.You can download from the Anli.