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LPC5534JBD64E Технические параметры

NXP  LPC5534JBD64E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка NXP
Mounting Type Surface Mount
Package / Case 64-TQFP Exposed Pad
Supplier Device Package 64-HTQFP (10x10)
MSL MSL 3 - 168 hours
Moisture Sensitive Yes
Factory Pack QuantityFactory Pack Quantity 160
Part # Aliases 935385032551
Manufacturer NXP
Brand NXP Semiconductors
RoHS Details
Number of I/Os 39I/Os
Package Tray
Base Product Number LPC5534
Mfr NXP USA Inc.
Data Converters A/D 13x16b; D/A 1x12b
Product Status Active
Series LPC553x
Packaging Tray
Свойство продукта Значение свойства
Operating Temperature -40°C ~ 105°C (TA)
Subcategory Microcontrollers - MCU
Interface CAN, I2C, I3C, I2S, SPI, UART, USB
Oscillator Type Internal
Speed 150MHz
RAM Size 96K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Core Processor ARM® Cortex®-M33
Peripherals DMA, PWM, WDT
Program Memory Type FLASH
Core Size 32-Bit Single-Core
Program Memory Size 128KB
Connectivity CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART
Data Bus Width 32bit
Product Type ARM Microcontrollers - MCU
EEPROM Size -
Product MCU
Product Category ARM Microcontrollers - MCU
Device Core ARM Cortex-M33
Просмотр сходства
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