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LPC5534JBD64K Технические параметры

NXP  LPC5534JBD64K technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка NXP
Contact Plating Gold
Mounting Type Surface Mount
Package / Case 64-TQFP Exposed Pad
Supplier Device Package 64-HTQFP (10x10)
Base/Housing Material Melamine
Contact Materials Silver Alloy
Pole Throw Configuration DP4T
Mounting Panel Mount
Moisture Sensitive Yes
Factory Pack QuantityFactory Pack Quantity 1
Part # Aliases 935385032557
Manufacturer NXP
Brand NXP Semiconductors
RoHS Details
Number of I/Os 39I/Os
Package Tray
Base Product Number LPC5534
Mfr NXP USA Inc.
Свойство продукта Значение свойства
Data Converters A/D 13x16b; D/A 1x12b
Product Status Active
Packaging Tray
Operating Temperature -40°C ~ 105°C (TA)
Series -
Subcategory Microcontrollers - MCU
Oscillator Type Internal
Speed 150MHz
RAM Size 96K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Core Processor ARM® Cortex®-M33
Peripherals DMA, PWM, WDT
Program Memory Type FLASH
Core Size 32-Bit Single-Core
Program Memory Size 128KB (128K x 8)
Connectivity CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART
Product Type ARM Microcontrollers - MCU
EEPROM Size -
Product Category ARM Microcontrollers - MCU
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