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LPC5536JBD64K Технические параметры

NXP  LPC5536JBD64K technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка NXP
Mounting Type Surface Mount
Package / Case 64-TQFP Exposed Pad
Supplier Device Package 64-HTQFP (10x10)
Qualification AEC-Q200
Moisture Sensitive Yes
Factory Pack QuantityFactory Pack Quantity 1
Part # Aliases 935385031557
Manufacturer NXP
Brand NXP Semiconductors
RoHS Details
Number of I/Os 39I/Os
Package Tray
Base Product Number LPC5536
Mfr NXP USA Inc.
Data Converters A/D 13x16b; D/A 1x12b
Product Status Active
Packaging Tray
Operating Temperature -40°C ~ 105°C (TA)
Series -
Свойство продукта Значение свойства
Temperature Coefficient 25 ppm/K
Resistance 4.32 kOhm
Subcategory Microcontrollers - MCU
Power Rating 0.125 W
Resistor Type Sulfur Resistant
Oscillator Type Internal
Speed 150MHz
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Core Processor ARM® Cortex®-M33
Peripherals DMA, PWM, WDT
Program Memory Type FLASH
Core Size 32-Bit Single-Core
Program Memory Size 256KB (256K x 8)
Connectivity CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART
Product Type ARM Microcontrollers - MCU
EEPROM Size -
Resistance Tolerance 0.1
Product Category ARM Microcontrollers - MCU
Product Length 1.6 mm
Product Width 0.85 mm
Просмотр сходства
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