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MC33FS4505LAER2 Технические параметры

NXP  MC33FS4505LAER2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Specialized
Марка NXP
Mounting Type Surface Mount
Housing Material Thermoplastic
Number of Positions or Pins (Grid) 478 (26 x 26)
Contact Material - Mating Copper Alloy
Contact Material - Post Copper Alloy
Contact Finish Mating Gold
Factory Pack QuantityFactory Pack Quantity 2000
Part # Aliases 935420063528
Manufacturer NXP
Brand NXP Semiconductors
Operating Temperature --
Series --
Packaging --
Свойство продукта Значение свойства
Part Status Obsolete
Termination Solder
Type PGA, ZIF (ZIP)
Subcategory PMIC - Power Management ICs
Pitch - Mating 0.050 (1.27mm)
Contact Finish - Post Gold
Contact Resistance --
Product Type Power Management Specialized - PMIC
Termination Post Length --
Pitch - Post 0.050 (1.27mm)
Features Open Frame
Product Category Power Management Specialized - PMIC
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish Thickness - Post 30.0µin (0.76µm)
Material Flammability Rating UL94 V-0
Просмотр сходства
MC33FS4505LAER2 brand manufacturers: NXP, Anli stock, MC33FS4505LAER2 reference price.NXP. MC33FS4505LAER2 parameters, MC33FS4505LAER2 Datasheet PDF and pin diagram description download.You can use the MC33FS4505LAER2 Specialized, DSP Datesheet PDF, find MC33FS4505LAER2 pin diagram and circuit diagram and usage method of function,MC33FS4505LAER2 electronics tutorials.You can download from the Anli.