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MF1S5001XDUF，005 Технические параметры

NXP  MF1S5001XDUF，005 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация RFID, RF Access, Monitoring ICs
Марка NXP
Mounting Type Through Hole
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 11 (1 x 11)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Supplier Package WAFER
Category Mainstream Contactless Smart Card
Mounting Surface Mount
Operating Temperature --
Series 518
Packaging Bulk
Свойство продукта Значение свойства
Part Status Active
Termination Solder
Type SIP
Current Rating 3A
Pitch - Mating 0.100 (2.54mm)
Contact Finish - Post Gold
Contact Resistance --
Termination Post Length 0.125 (3.18mm)
Pitch - Post 0.100 (2.54mm)
Features Open Frame
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish Thickness - Post 10.0µin (0.25µm)
Material Flammability Rating UL94 V-0
Просмотр сходства
MF1S5001XDUF，005 brand manufacturers: NXP, Anli stock, MF1S5001XDUF，005 reference price.NXP. MF1S5001XDUF，005 parameters, MF1S5001XDUF，005 Datasheet PDF and pin diagram description download.You can use the MF1S5001XDUF，005 RFID, RF Access, Monitoring ICs, DSP Datesheet PDF, find MF1S5001XDUF，005 pin diagram and circuit diagram and usage method of function,MF1S5001XDUF，005 electronics tutorials.You can download from the Anli.