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- MSCMMX6QZDK08AB
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MSCMMX6QZDK08AB Технические параметры
NXP MSCMMX6QZDK08AB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | NXP | |
| Surface Mount | YES | |
| Number of Terminals | 500Terminals | |
| Package Description | FBGA, | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | MSCMMX6QZDK08AB | |
| Package Code | FBGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | NXP Semiconductors | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Risk Rank | 5.83 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| HTS Code | 8542.31.00.01 | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 0.65 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | R-PBGA-B500 | |
| Temperature Grade | OTHER | |
| Speed | 800 MHz | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC | |
| Seated Height-Max | 1.8 mm | |
| Boundary Scan | YES | |
| Low Power Mode | YES | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| Width | 14 mm | |
| Length | 17 mm |
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