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74AUP1G175GW,125 Технические параметры

NXP Semiconductors  74AUP1G175GW,125 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Logic - Latches
Марка
Surface Mount YES
Number of Terminals 6Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description SOT-363, SC-88, 6 PIN
Manufacturer Package Code SOT363
Load Capacitance (CL) 30 pF
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP6,.08
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Supply Voltage-Nom (Vsup) 1.2 V
JESD-609 Code e3
Terminal Finish TIN
HTS Code 8542.39.00.01
Packing Method TR
Terminal Position DUAL
Terminal Form GULL WING
Свойство продукта Значение свойства
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.65 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 6
JESD-30 Code R-PDSO-G6
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade AUTOMOTIVE
Supply Voltage-Min (Vsup) 0.8 V
Number of Bits 1Bit
Family AUP/ULP/V
Seated Height-Max 1.1 mm
Output Polarity TRUE
Logic IC Type D FLIP-FLOP
Max I(ol) 0.0017 A
Prop. Delay@Nom-Sup 21 ns
Trigger Type POSITIVE EDGE
Propagation Delay (tpd) 21 ns
fmax-Min 410 MHz
Max Frequency@Nom-Sup 70000000 Hz
Saturation Current 1
Length 2 mm
Width 1.25 mm

74AUP1G175GW,125 Документы

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