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74LVC16244ADGG,518 Технические параметры

NXP Semiconductors  74LVC16244ADGG,518 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Logic - Specialty Logic
Марка
Lifecycle Status Obsolete (Last Updated: 1 day ago)
Mount Surface Mount
Surface Mount YES
Number of Pins 48Pins
Number of Terminals 48Terminals
PCB changed 48
Typical Operating Supply Voltage (V) 1.8|2.5|3.3
Minimum Operating Supply Voltage (V) 1.2
Maximum High Level Output Current (mA) -24
Maximum Low Level Output Current (mA) 24
Input Signal Type Single-Ended
Process Technology CMOS
Absolute Propagation Delay Time (ns) 12.7
Maximum Propagation Delay Time @ Maximum CL (ns) 2.6(Typ)@2.7V|2.2(Typ)@3.3V
Bus Hold No
Number of Output Enables per Chip 4 Low
Number of Outputs per Chip 16Outputs per Chips
Number of Input Enables per Chip 0
Number of Inputs per Chip 16Inputs per Chips
Number of Channels per Chip 16Channels per Chips
Number of Elements per Chip 4Elements per Chips
Logic Family LVC
ECCN (US) EAR99
Maximum Operating Temperature (°C) 125
Minimum Operating Temperature (°C) -40
Maximum Power Dissipation (mW) 500
Propagation Delay Test Condition (pF) 50
Maximum Quiescent Current (uA) 80
Typical Quiescent Current (uA) 0.1
Tolerant I/Os (V) 5
Maximum Operating Supply Voltage (V) 3.6
Mounting Surface Mount
Supplier Package TSSOP
Package Length 12.6(Max)
Package Height 1.05(Max)
Package Width 6.2(Max)
Number of Elements 4 Elements
RoHS Compliant
Package Description 6.10 MM, ROHS COMPLIANT, PLASTIC, MO-153, SOT362-1, TSSOP-48
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Moisture Sensitivity Levels 2
Load Capacitance (CL) 50 pF
Package Body Material PLASTIC/EPOXY
Package Equivalence Code TSSOP48,.3,20
Manufacturer Package Code SOT362-1
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) 30
Operating Temperature-Max 125 °C
Rohs Code Yes
Manufacturer Part Number 74LVC16244ADGG,518
Supply Voltage-Nom (Vsup) 2.7 V
Package Code TSSOP
Package Shape RECTANGULAR
Manufacturer NXP Semiconductors
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Свойство продукта Значение свойства
Risk Rank 5.14
Part Package Code TSSOP
Prop. 5.5 ns
Packaging Tape and Reel
JESD-609 Code e4
Part Status Obsolete
Terminal Finish NICKEL PALLADIUM GOLD
Max Operating Temperature 125 °C
Min Operating Temperature -40 °C
HTS Code 8542.39.00.01
Subcategory Bus Driver/Transceivers
Packing Method TAPE AND REEL
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 4Functions
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Pin Count 48
JESD-30 Code R-PDSO-G48
Number of Outputs 16Outputs
Qualification Status Not Qualified
Output Type 3-State
Polarity Non-Inverting
Supply Voltage-Max (Vsup) 3.6 V
Power Supplies 3.3 V
Temperature Grade AUTOMOTIVE
Supply Voltage-Min (Vsup) 1.2 V
Number of Channels 16Channels
Max Supply Voltage 3.6 V
Min Supply Voltage 1.2 V
Number of Ports 2Ports
Number of Bits 4Bits
Propagation Delay 2.2 ns
Quiescent Current 80 µA
Turn On Delay Time 12.7 ns
Family LVC/LCX/Z
Logic Function Buffer/Line Driver
Number of Inputs 16Inputs
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Output Polarity TRUE
Logic IC Type BUS DRIVER
Max I(ol) 0.024 A
High Level Output Current -24 mA
Propagation Delay (tpd) 6 ns
Low Level Output Current 24 mA
Control Type ENABLE LOW
Number of Input Lines 16Input Lines
Number of Output Lines 16Output Lines
Source Url Status Check Date 2013-10-15 00:00:00
Width 6.1 mm
Length 12.5 mm
RoHS Status RoHS Compliant
Radiation Hardening No
Lead Free Lead Free

74LVC16244ADGG,518 Документы

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