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NXP Semiconductors BYV32E-200127 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Diodes - RF | |
| Марка | ||
| Factory Lead Time | 6 Weeks | |
| Contact Plating | Tin | |
| Mount | Through Hole | |
| Surface Mount | NO | |
| Number of Pins | 3Pins | |
| Weight | 4.535924 g | |
| Diode Element Material | SILICON | |
| Number of Terminals | 3Terminals | |
| ECCN (US) | EAR99 | |
| HTS | 8541.10.00.80 | |
| Maximum DC Reverse Voltage (V) | 200 | |
| Peak Reverse Repetitive Voltage (V) | 200 | |
| Maximum Continuous Forward Current (A) | 20 | |
| Peak Non-Repetitive Surge Current (A) | 137 | |
| Peak Forward Voltage (V) | 1.15 | |
| Peak Reverse Current (uA) | 30 | |
| Peak Reverse Recovery Time (ns) | 25 | |
| Minimum Operating Temperature (°C) | -40 | |
| Maximum Operating Temperature (°C) | 150 | |
| Supplier Package | TO-220AB | |
| Military | No | |
| Mounting | Through Hole | |
| Package Height | 9.4(Max) | |
| Package Length | 10.3(Max) | |
| Package Width | 4.7(Max) | |
| PCB changed | 3 | |
| Tab | Tab | |
| RoHS | Compliant | |
| Package | Bulk | |
| Mfr | NXP Semiconductors | |
| Product Status | Active | |
| Risk Rank | 1.19 | |
| Forward Voltage-Max (VF) | 1.15 V | |
| Ihs Manufacturer | WEEN SEMICONDUCTORS CO LTD | |
| Part Life Cycle Code | Active | |
| Number of Elements | 2 Elements | |
| Manufacturer | WeEn Semiconductor Co Ltd | |
| Package Shape | RECTANGULAR | |
| Manufacturer Part Number | BYV32E-200,127 | |
| Rohs Code | Yes | |
| Operating Temperature-Max | 150 °C | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Style | FLANGE MOUNT |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Package Description | PLASTIC, SC-46, 3 PIN | |
| Packaging | Rail | |
| Series | * | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| ECCN Code | EAR99 | |
| Type | Switching Diode | |
| Terminal Finish | Tin (Sn) | |
| Max Operating Temperature | 150 °C | |
| Min Operating Temperature | -40 °C | |
| Applications | ULTRA FAST SOFT RECOVERY | |
| Terminal Position | SINGLE | |
| Terminal Form | THROUGH-HOLE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Reach Compliance Code | not_compliant | |
| Pin Count | 3 | |
| Reference Standard | IEC-60134 | |
| JESD-30 Code | R-PSFM-T3 | |
| Configuration | Dual Common Cathode | |
| Element Configuration | Common Cathode | |
| Diode Type | RECTIFIER DIODE | |
| Case Connection | CATHODE | |
| Forward Current | 20 A | |
| Max Surge Current | 137 A | |
| Forward Voltage | 1.15 V | |
| Max Reverse Voltage (DC) | 200 V | |
| Average Rectified Current | 20 A | |
| Number of Phases | 1Phase | |
| Reverse Recovery Time | 25 ns | |
| Peak Reverse Current | 30 µA | |
| Max Repetitive Reverse Voltage (Vrrm) | 200 V | |
| Rep Pk Reverse Voltage-Max | 200 V | |
| JEDEC-95 Code | TO-220AB | |
| Peak Non-Repetitive Surge Current | 137 A | |
| Non-rep Pk Forward Current-Max | 137 A | |
| Reverse Voltage | 200 V | |
| Reverse Current-Max | 30 µA | |
| Max Forward Surge Current (Ifsm) | 137 A | |
| Recovery Time | 25 ns | |
| Reverse Recovery Time-Max | 0.025 µs | |
| Width | 4.7 mm | |
| Height | 9.4 mm | |
| Length | 10.3 mm | |
| RoHS Status | Yes with exemptions | |
| Radiation Hardening | No | |
| Lead Free | Lead Free |