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MC9S12DG256CFUE Технические параметры

NXP Semiconductors  MC9S12DG256CFUE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontroller, Microprocessor, FPGA Modules
Марка
Contact Plating Tin
Mount Surface Mount
Number of Pins 80Pins
Weight 935.505914 mg
Case/Package QFP
Memory Types FLASH
Number of I/Os 59I/Os
RoHS Compliant
Schedule B 8542310000, 8542310000|8542310000|8542310000|8542310000|8542310000
Watchdog Timers Yes
Max Operating Temperature 85 °C
Min Operating Temperature -40 °C
Frequency 25 MHz
Operating Supply Voltage 5 V
Interface CAN, I2C, SCI, SPI
Max Supply Voltage 5.25 V
Min Supply Voltage 2.35 V
Memory Size 256 kB
Oscillator Type Internal
RAM Size 12 kB
Свойство продукта Значение свойства
Number of Bits 16Bits
Peripherals I2C, PWM, WDT
Data Bus Width 16 b
Number of Timers/Counters 13Timers/Counters
Density 2 Mb
Core Architecture HCS12
Max Frequency 25 MHz
Number of A/D Converters 2A/D Converters
Number of Programmable I/O 91Programmable I/Os
Number of ADC Channels 8ADC Channels
Max Junction Temperature (Tj) 100 °C
Number of PWM Channels 8PWM Channels
Number of I2C Channels 1I2C Channel
Ambient Temperature Range High 85 °C
Number of SPI Channels 3SPI Channels
Height 2.45 mm
Length 14 mm
Width 14 mm
Radiation Hardening No
REACH SVHC No SVHC
Lead Free Lead Free
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MC9S12DG256CFUE Документы

MC9S12DG256CFUE brand manufacturers: NXP Semiconductors, Anli stock, MC9S12DG256CFUE reference price.NXP Semiconductors. MC9S12DG256CFUE parameters, MC9S12DG256CFUE Datasheet PDF and pin diagram description download.You can use the MC9S12DG256CFUE Embedded - Microcontroller, Microprocessor, FPGA Modules, DSP Datesheet PDF, find MC9S12DG256CFUE pin diagram and circuit diagram and usage method of function,MC9S12DG256CFUE electronics tutorials.You can download from the Anli.