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MCIMX6S5DVM10AD Технические параметры
NXP Semiconductors MCIMX6S5DVM10AD technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - Microcontroller, Microprocessor, FPGA Modules | |
| Марка | ||
| Factory Lead Time | 16 Weeks | |
| Surface Mount | YES | |
| Number of Terminals | 624Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | MABGA-624 | |
| Moisture Sensitivity Levels | 3 | |
| Operating Temperature-Max | 95 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA624,25X25,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Supply Voltage-Max | 1.5 V |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Supply Voltage-Min | 1.35 V | |
| JESD-609 Code | e1 | |
| ECCN Code | 5A992.C | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| JESD-30 Code | S-PBGA-B624 | |
| Temperature Grade | OTHER | |
| uPs/uCs/Peripheral ICs Type | SoC | |
| Seated Height-Max | 1.6 mm | |
| Length | 21 mm | |
| Width | 21 mm |
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