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MPC5553MVZ112 Технические параметры

NXP Semiconductors  MPC5553MVZ112 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Surface Mount YES
Number of Terminals 324Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 23 X 23 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAJ-1, BGA-324
Clock Frequency-Max 20 MHz
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
RAM(byte) 65536
ROM(word) 1572864
Supply Voltage-Max 1.65 V
Supply Voltage-Min 1.35 V
Supply Voltage-Nom 1.5 V
ECCN Code 3A991.A.2
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Свойство продукта Значение свойства
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
Temperature Grade AUTOMOTIVE
Speed 112 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 510 mA
Bit Size 32
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Seated Height-Max 2.55 mm
Address Bus Width 24
On Chip Program ROM Width 8
External Data Bus Width 32
ROM Programmability FLASH
Length 23 mm
Width 23 mm
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MPC5553MVZ112 Документы

MPC5553MVZ112 brand manufacturers: NXP Semiconductors, Anli stock, MPC5553MVZ112 reference price.NXP Semiconductors. MPC5553MVZ112 parameters, MPC5553MVZ112 Datasheet PDF and pin diagram description download.You can use the MPC5553MVZ112 Embedded - Microcontrollers, DSP Datesheet PDF, find MPC5553MVZ112 pin diagram and circuit diagram and usage method of function,MPC5553MVZ112 electronics tutorials.You can download from the Anli.