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MPC8569ECVJAQLJB Технические параметры

NXP Semiconductors  MPC8569ECVJAQLJB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Factory Lead Time 4 Weeks
Surface Mount YES
Number of Terminals 783Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783
Clock Frequency-Max 133 MHz
Moisture Sensitivity Levels 3
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA783,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Supply Voltage-Max 1.03 V
Supply Voltage-Min 0.97 V
Supply Voltage-Nom 1 V
JESD-609 Code e1
ECCN Code 5A002.A.1
Свойство продукта Значение свойства
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Terminal Pitch 1 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B783
Qualification Status Not Qualified
Speed 1067 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 3.94 mm
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Length 29 mm
Width 29 mm
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MPC8569ECVJAQLJB Документы

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