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P89LPC932FDH Технические параметры

NXP Semiconductors  P89LPC932FDH technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Surface Mount YES
Number of Terminals 28Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT-361-1, TSSOP-28
Clock Frequency-Max 12 MHz
Number of I/O Lines 26I/O Lines
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP28,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
RAM(byte) 768
ROM(word) 8192
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
JESD-609 Code e3
Terminal Finish TIN
Свойство продукта Значение свойства
HTS Code 8542.31.00.01
Terminal Position DUAL
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
Pin Count 28
JESD-30 Code R-PDSO-G28
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Speed 12 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 18 mA
Bit Size 8
Has ADC NO
DMA Channels NO
PWM Channels YES
DAC Channels NO
Seated Height-Max 1.1 mm
On Chip Program ROM Width 8
CPU Family 8051
ROM Programmability FLASH
Length 9.7 mm
Width 4.4 mm
Просмотр сходства

P89LPC932FDH Документы

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