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TDA18250BHN/C1 Технические параметры

NXP Semiconductors  TDA18250BHN/C1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Interface - Telecom
Марка
Surface Mount YES
Contact plating gold-plated
Number of pins 3pins
Number of Terminals 32Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, ROHS COMPLIANT, HVQFN-32
Package Body Material PLASTIC/EPOXY
Package Code QCCN
Package Shape SQUARE
Package Style CHIP CARRIER
Supply Voltage-Nom 3.3 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Свойство продукта Значение свойства
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 1x3
Gross weight 0.11 g
Operating temperature -40...163°C
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
Current rating 1.5A
JESD-30 Code S-PQCC-N32
Telecom IC Type TELECOM CIRCUIT
Rated voltage 60V
Profile beryllium copper
Plating thickness 0.254µm
Flammability rating UL94V-0

TDA18250BHN/C1 Документы

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