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XPC755BPX350LD Технические параметры

NXP Semiconductors  XPC755BPX350LD technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Surface Mount YES
Number of Terminals 360Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description BGA,
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Свойство продукта Значение свойства
Supply Voltage-Nom 2 V
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B360
Speed 350 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Boundary Scan YES
Low Power Mode NO
Format FIXED POINT
Integrated Cache NO
Просмотр сходства

XPC755BPX350LD Документы

XPC755BPX350LD brand manufacturers: NXP Semiconductors, Anli stock, XPC755BPX350LD reference price.NXP Semiconductors. XPC755BPX350LD parameters, XPC755BPX350LD Datasheet PDF and pin diagram description download.You can use the XPC755BPX350LD Embedded - Microprocessors, DSP Datesheet PDF, find XPC755BPX350LD pin diagram and circuit diagram and usage method of function,XPC755BPX350LD electronics tutorials.You can download from the Anli.