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DSPB56374AF Технические параметры

NXP USA Inc.  DSPB56374AF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - DSP (Digital Signal Processors)
Марка
Mounting Type Surface Mount
Package / Case 80-LQFP
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Series DSP56K/Symphony
Published 2005
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 80Terminations
ECCN Code 3A991.A.2
Type Audio Processor
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.25V
Terminal Pitch 0.65mm
Свойство продукта Значение свойства
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number DSPB56374
JESD-30 Code S-PQFP-G80
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.3V
Supply Voltage-Min (Vsup) 1.2V
Interface Host Interface, I2C, SAI, SPI
Clock Frequency 149.9MHz
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Voltage - I/O 3.30V
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Non-Volatile Memory ROM (84kB)
Voltage - Core 1.25V
On Chip Data RAM 54kB
Clock Rate 150MHz
Length 14mm
Height Seated (Max) 1.6mm
Width 14mm
RoHS Status ROHS3 Compliant
Просмотр сходства

DSPB56374AF Документы

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