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MC68EN360VR25VL Технические параметры

NXP USA Inc.  MC68EN360VR25VL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Factory Lead Time 8 Weeks
Package / Case 357-BBGA
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Series M683xx
Published 1995
JESD-609 Code e1
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC68EN360
JESD-30 Code S-PBGA-B357
Свойство продукта Значение свойства
Supply Voltage-Max (Vsup) 5.25V
Supply Voltage-Min (Vsup) 4.75V
Speed 25MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor CPU32+
Clock Frequency 33.34MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
Length 25mm
Height Seated (Max) 1.86mm
RoHS Status ROHS3 Compliant

MC68EN360VR25VL Документы

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