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MC9S08DZ60ACLC Технические параметры

NXP USA Inc.  MC9S08DZ60ACLC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 32-LQFP
Surface Mount YES
Data Converters A/D 10x12b
Number of I/Os 25I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series S08
Published 1996
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 32Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Свойство продукта Значение свойства
Base Part Number MC9S08DZ60
JESD-30 Code S-PQFP-G32
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type External
Speed 40MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 16MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 60KB 60K x 8
Connectivity CANbus, I2C, LINbus, SCI, SPI
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
EEPROM Size 2K x 8
Length 7mm
Height Seated (Max) 1.6mm
Width 7mm
RoHS Status ROHS3 Compliant

MC9S08DZ60ACLC Документы

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