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MC9S08PA16VTJ Технические параметры

NXP USA Inc.  MC9S08PA16VTJ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Data Converters A/D 12x12b
Number of I/Os 18I/Os
Operating Temperature -40°C~105°C TA
Packaging Tube
Series S08
Published 2002
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Свойство продукта Значение свойства
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type Internal
Speed 20MHz
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 20MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 16KB 16K x 8
Connectivity I2C, LINbus, SPI, UART/USART
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
EEPROM Size 256 x 8
Length 6.5mm
Width 4.4mm
RoHS Status ROHS3 Compliant

MC9S08PA16VTJ Документы

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