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MC9S08PA4VWJ Технические параметры

NXP USA Inc.  MC9S08PA4VWJ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Data Converters A/D 8x12b
Number of I/Os 18I/Os
ROM(word) 4096
Operating Temperature -40°C~105°C TA
Packaging Tube
Series S08
Published 2012
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Свойство продукта Значение свойства
Base Part Number MC9S08PA4
JESD-30 Code R-PDSO-G20
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5V
Power Supplies 3/5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type Internal
Speed 20MHz
RAM Size 512 x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 20MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 4KB 4K x 8
Connectivity LINbus, SPI, UART/USART
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
EEPROM Size 128 x 8
Length 12.8mm
Width 7.5mm
RoHS Status ROHS3 Compliant
Просмотр сходства

MC9S08PA4VWJ Документы

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