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MCF51AC256BCLKE Технические параметры

NXP USA Inc.  MCF51AC256BCLKE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 80-LQFP
Surface Mount YES
Data Converters A/D 24x12b
Number of I/Os 69I/Os
ROM(word) 262144
Operating Temperature -40°C~85°C TA
Packaging Tray
Series MCF51AC
Published 2007
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 80Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCF51AC256
Свойство продукта Значение свойства
JESD-30 Code S-PQFP-G80
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5V
Power Supplies 3/5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type External
Speed 50MHz
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor Coldfire V1
Peripherals LVD, PWM, WDT
Clock Frequency 16MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 256KB 256K x 8
Connectivity I2C, SCI, SPI
Bit Size 32
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Length 14mm
Height Seated (Max) 1.74mm
Width 14mm
RoHS Status ROHS3 Compliant
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MCF51AC256BCLKE Документы

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