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MCIMX6X4AVM08AC Технические параметры
NXP USA Inc. MCIMX6X4AVM08AC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - Microprocessors | |
| Марка | ||
| Factory Lead Time | 14 Weeks | |
| Package / Case | 529-LFBGA | |
| Operating Temperature | -40°C~125°C TJ | |
| Packaging | Tray | |
| Series | i.MX6SX | |
| Published | 2017 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| HTS Code | 8542.39.00.01 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Speed | 200MHz, 800MHz | |
| Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.15V | |
| Ethernet | 10/100/1000Mbps (2) | |
| Number of Cores/Bus Width | 2 Core 32-Bit | |
| Graphics Acceleration | Yes | |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 | |
| USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | |
| Additional Interfaces | AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | |
| Co-Processors/DSP | Multimedia; NEON™ MPE | |
| Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | |
| Display & Interface Controllers | Keypad, LCD, LVDS | |
| RoHS Status | ROHS3 Compliant |
MCIMX6X4AVM08AC Документы
- DatasheetsMCIMX6XxAxx(B,C) Datasheet
- Environmental InformationNXP RoHS3 Cert
- PCN PackagingMult Dev ShipBox Chg 14/Feb/2022
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