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MKL33Z256VMP4 Технические параметры

NXP USA Inc.  MKL33Z256VMP4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 64-LFBGA
Surface Mount YES
Data Converters A/D 20x16b; D/A 1x12b
Number of I/Os 54I/Os
Operating Temperature -40°C~105°C TA
Packaging Tray
Series Kinetis KL3
Published 2015
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Свойство продукта Значение свойства
JESD-30 Code S-PBGA-B64
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Speed 48MHz
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M0+
Peripherals DMA, I2S, LCD, LVD, POR, PWM, WDT
Clock Frequency 48MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 256KB 256K x 8
Connectivity I2C, SPI, UART/USART
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
Length 5mm
Width 5mm
RoHS Status ROHS3 Compliant

MKL33Z256VMP4 Документы

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