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MPC755BVT300LE Технические параметры

NXP USA Inc.  MPC755BVT300LE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Package / Case 360-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC7xx
Published 2001
JESD-609 Code e2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 360Terminations
ECCN Code 3A991.A.1
Terminal Finish TIN COPPER/TIN SILVER
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 2V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Свойство продукта Значение свойства
Base Part Number MPC755
JESD-30 Code S-PBGA-B360
Supply Voltage-Max (Vsup) 2.1V
Supply Voltage-Min (Vsup) 1.8V
Speed 300MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC
Clock Frequency 100MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
Length 25mm
Height Seated (Max) 2.77mm
RoHS Status ROHS3 Compliant
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MPC755BVT300LE Документы

MPC755BVT300LE brand manufacturers: NXP USA Inc., Anli stock, MPC755BVT300LE reference price.NXP USA Inc.. MPC755BVT300LE parameters, MPC755BVT300LE Datasheet PDF and pin diagram description download.You can use the MPC755BVT300LE Embedded - Microprocessors, DSP Datesheet PDF, find MPC755BVT300LE pin diagram and circuit diagram and usage method of function,MPC755BVT300LE electronics tutorials.You can download from the Anli.