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MPC8313CZQAGDC Технические параметры

NXP USA Inc.  MPC8313CZQAGDC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Factory Lead Time 8 Weeks
Package / Case 516-BBGA Exposed Pad
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Tray
Series MPC83xx
Published 2002
JESD-609 Code e0
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 516Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC8313
JESD-30 Code S-PBGA-B516
Свойство продукта Значение свойства
Supply Voltage-Max (Vsup) 1.05V
Power Supplies 11.8/2.53.3V
Supply Voltage-Min (Vsup) 0.95V
Speed 400MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e300c3
Bit Size 32
Address Bus Width 15
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, DDR2
USB USB 2.0 + PHY (1)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI
Length 27mm
Height Seated (Max) 2.55mm
RoHS Status Non-RoHS Compliant
Просмотр сходства

MPC8313CZQAGDC Документы

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