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MPC850DEZQ80BU Технические параметры

NXP USA Inc.  MPC850DEZQ80BU technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Factory Lead Time 12 Weeks
Package / Case 256-BBGA
Surface Mount YES
Operating Temperature 0°C~95°C TA
Packaging Tray
Series MPC8xx
Published 1997
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC850
JESD-30 Code S-PBGA-B256
Свойство продукта Значение свойства
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Speed 80MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
Length 23mm
Height Seated (Max) 2.54mm
RoHS Status Non-RoHS Compliant
Просмотр сходства

MPC850DEZQ80BU Документы

MPC850DEZQ80BU brand manufacturers: NXP USA Inc., Anli stock, MPC850DEZQ80BU reference price.NXP USA Inc.. MPC850DEZQ80BU parameters, MPC850DEZQ80BU Datasheet PDF and pin diagram description download.You can use the MPC850DEZQ80BU Embedded - Microprocessors, DSP Datesheet PDF, find MPC850DEZQ80BU pin diagram and circuit diagram and usage method of function,MPC850DEZQ80BU electronics tutorials.You can download from the Anli.