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MPC850DSLCZQ50BU Технические параметры

NXP USA Inc.  MPC850DSLCZQ50BU technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Package / Case 256-BBGA
Surface Mount YES
Operating Temperature -40°C~95°C TA
Packaging Tray
Series MPC8xx
Published 1997
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC850
JESD-30 Code S-PBGA-B256
Supply Voltage-Max (Vsup) 3.465V
Свойство продукта Значение свойства
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3.135V
Speed 50MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Clock Frequency 50MHz
Bit Size 32
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
Length 23mm
Height Seated (Max) 2.35mm
RoHS Status Non-RoHS Compliant
Просмотр сходства

MPC850DSLCZQ50BU Документы

MPC850DSLCZQ50BU brand manufacturers: NXP USA Inc., Anli stock, MPC850DSLCZQ50BU reference price.NXP USA Inc.. MPC850DSLCZQ50BU parameters, MPC850DSLCZQ50BU Datasheet PDF and pin diagram description download.You can use the MPC850DSLCZQ50BU Embedded - Microprocessors, DSP Datesheet PDF, find MPC850DSLCZQ50BU pin diagram and circuit diagram and usage method of function,MPC850DSLCZQ50BU electronics tutorials.You can download from the Anli.