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MPC8555EPXAPF Технические параметры

NXP USA Inc.  MPC8555EPXAPF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Factory Lead Time 12 Weeks
Package / Case 783-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC85xx
Published 2002
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 783Terminations
ECCN Code 5A002.A.1
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MPC8555
JESD-30 Code S-PBGA-B783
Supply Voltage-Max (Vsup) 1.26V
Свойство продукта Значение свойства
Supply Voltage-Min (Vsup) 1.14V
Speed 833MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e500
Clock Frequency 166MHz
Bit Size 32
Address Bus Width 64
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, SDRAM
USB USB 2.0 (1)
Additional Interfaces DUART, I2C, PCI, SPI, TDM, UART
Co-Processors/DSP Communications; CPM, Security; SEC
Security Features Cryptography, Random Number Generator
Length 29mm
Height Seated (Max) 3.75mm
RoHS Status Non-RoHS Compliant
Просмотр сходства

MPC8555EPXAPF Документы

MPC8555EPXAPF brand manufacturers: NXP USA Inc., Anli stock, MPC8555EPXAPF reference price.NXP USA Inc.. MPC8555EPXAPF parameters, MPC8555EPXAPF Datasheet PDF and pin diagram description download.You can use the MPC8555EPXAPF Embedded - Microprocessors, DSP Datesheet PDF, find MPC8555EPXAPF pin diagram and circuit diagram and usage method of function,MPC8555EPXAPF electronics tutorials.You can download from the Anli.