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MPC860DEZQ50D4 Технические параметры

NXP USA Inc.  MPC860DEZQ50D4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Package / Case 357-BBGA
Surface Mount YES
Operating Temperature 0°C~95°C TA
Packaging Tray
Series MPC8xx
Published 2004
JESD-609 Code e0
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MPC860
JESD-30 Code S-PBGA-B357
Свойство продукта Значение свойства
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3.135V
Speed 50MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Clock Frequency 50MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP Communications; CPM
Length 25mm
Height Seated (Max) 2.52mm
RoHS Status Non-RoHS Compliant
Просмотр сходства

MPC860DEZQ50D4 Документы

MPC860DEZQ50D4 brand manufacturers: NXP USA Inc., Anli stock, MPC860DEZQ50D4 reference price.NXP USA Inc.. MPC860DEZQ50D4 parameters, MPC860DEZQ50D4 Datasheet PDF and pin diagram description download.You can use the MPC860DEZQ50D4 Embedded - Microprocessors, DSP Datesheet PDF, find MPC860DEZQ50D4 pin diagram and circuit diagram and usage method of function,MPC860DEZQ50D4 electronics tutorials.You can download from the Anli.