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MPC870CZT133 Технические параметры

NXP USA Inc.  MPC870CZT133 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Factory Lead Time 12 Weeks
Package / Case 256-BBGA
Surface Mount YES
Operating Temperature -40°C~100°C TA
Packaging Tray
Series MPC8xx
Published 1999
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code 5A992
Terminal Finish TIN LEAD
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MPC870
JESD-30 Code S-PBGA-B256
Свойство продукта Значение свойства
Supply Voltage-Max (Vsup) 1.9V
Power Supplies 1.83.3V
Supply Voltage-Min (Vsup) 1.7V
Speed 133MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10/100Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 2.0 (1)
Additional Interfaces I2C, PCMCIA, SPI, TDM, UART
Co-Processors/DSP Communications; CPM
Length 23mm
Height Seated (Max) 2.54mm
RoHS Status Non-RoHS Compliant

MPC870CZT133 Документы

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