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MPC885VR66 Технические параметры

NXP USA Inc.  MPC885VR66 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Factory Lead Time 12 Weeks
Package / Case 357-BBGA
Surface Mount YES
Operating Temperature 0°C~95°C TA
Packaging Tray
Series MPC8xx
Published 1999
JESD-609 Code e1
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357Terminations
ECCN Code 5A002.A.1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC885
JESD-30 Code S-PBGA-B357
Свойство продукта Значение свойства
Supply Voltage-Max (Vsup) 1.9V
Power Supplies 1.83.3V
Supply Voltage-Min (Vsup) 1.7V
Speed 66MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (3), 10/100Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 2.0 (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP Communications; CPM, Security; SEC
Security Features Cryptography
Length 25mm
Height Seated (Max) 2.52mm
RoHS Status ROHS3 Compliant
Просмотр сходства

MPC885VR66 Документы

MPC885VR66 brand manufacturers: NXP USA Inc., Anli stock, MPC885VR66 reference price.NXP USA Inc.. MPC885VR66 parameters, MPC885VR66 Datasheet PDF and pin diagram description download.You can use the MPC885VR66 Embedded - Microprocessors, DSP Datesheet PDF, find MPC885VR66 pin diagram and circuit diagram and usage method of function,MPC885VR66 electronics tutorials.You can download from the Anli.