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P89LPC931FDH,112 Технические параметры

NXP USA Inc.  P89LPC931FDH,112 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Mounting Type Surface Mount
Package / Case 28-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Number of I/Os 26I/Os
ROM(word) 8192
Operating Temperature -40°C~85°C TA
Packaging Tube
Series LPC900
Published 2000
JESD-609 Code e4
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 28Terminations
Terminal Finish NICKEL PALLADIUM GOLD
Additional Feature OPERATES AT 2.4V MINIMUM SUPPLY @ 12 MHZ
HTS Code 8542.31.00.01
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number P89LPC93*
Pin Count 28
JESD-30 Code R-PDSO-G28
Свойство продукта Значение свойства
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 2.5/3.3V
Supply Voltage-Min (Vsup) 3V
Oscillator Type Internal
Speed 12MHz
RAM Size 256 x 8
Voltage - Supply (Vcc/Vdd) 2.4V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor 8051
Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT
Clock Frequency 18MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 8KB 8K x 8
Connectivity I2C, SPI, UART/USART
Supply Current-Max 18mA
Bit Size 8
Has ADC NO
DMA Channels NO
PWM Channels YES
DAC Channels NO
Length 9.7mm
Height Seated (Max) 1.1mm
Width 4.4mm
RoHS Status ROHS3 Compliant

P89LPC931FDH,112 Документы

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