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S9S08DZ60F2MLCR Технические параметры

NXP USA Inc.  S9S08DZ60F2MLCR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 32-LQFP
Surface Mount YES
Data Converters A/D 10x12b
Number of I/Os 25I/Os
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Series S08
Published 1996
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 32Terminations
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Свойство продукта Значение свойства
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type External
Speed 40MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 20MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 60KB 60K x 8
Connectivity CANbus, I2C, LINbus, SCI, SPI
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
EEPROM Size 2K x 8
Length 7mm
Width 7mm
RoHS Status ROHS3 Compliant

S9S08DZ60F2MLCR Документы

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