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SPC5517EBMLQ66 Технические параметры

NXP USA Inc.  SPC5517EBMLQ66 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 144-LQFP
Surface Mount YES
Data Converters A/D 40x12b
Number of I/Os 111I/Os
ROM(word) 196608
Usage Level Automotive grade
Operating Temperature -40°C~125°C TA
Packaging Tray
Series MPC55xx Qorivva
Published 2004
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number SPC5517
JESD-30 Code S-PQFP-G144
Свойство продукта Значение свойства
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.25V
Power Supplies 5V
Supply Voltage-Min (Vsup) 4.5V
Oscillator Type Internal
Speed 66MHz
RAM Size 80K x 8
Voltage - Supply (Vcc/Vdd) 4.5V~5.25V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor e200z0, e200z1
Peripherals DMA, POR, PWM, WDT
Clock Frequency 40MHz
Program Memory Type FLASH
Core Size 32-Bit Dual-Core
Program Memory Size 1.5MB 1.5M x 8
Connectivity CANbus, EBI/EMI, I2C, SCI, SPI
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels NO
DAC Channels NO
Address Bus Width 23
Screening Level AEC-Q100
External Data Bus Width 23
Length 20mm
Height Seated (Max) 1.6mm
Width 20mm
RoHS Status ROHS3 Compliant

SPC5517EBMLQ66 Документы

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