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SPC5676RDK3MVY1 Технические параметры

NXP USA Inc.  SPC5676RDK3MVY1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 516-BBGA
Surface Mount YES
Data Converters A/D 64x12b
RAM(byte) 393216
ROM(word) 6291456
Operating Temperature -40°C~125°C TA
Packaging Tray
Series MPC56xx Qorivva
Published 2007
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 516Terminations
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B516
Supply Voltage-Max (Vsup) 1.32V
Свойство продукта Значение свойства
Supply Voltage-Min (Vsup) 1.14V
Oscillator Type Internal
Speed 180MHz
RAM Size 384K x 8
Voltage - Supply (Vcc/Vdd) 1.14V~1.32V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor e200z7
Peripherals DMA, POR, PWM
Clock Frequency 40MHz
Program Memory Type FLASH
Core Size 32-Bit Dual-Core
Program Memory Size 6MB 6M x 8
Connectivity CANbus, EBI/EMI, SCI, SPI
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
Address Bus Width 32
On Chip Program ROM Width 8
External Data Bus Width 32
Length 27mm
Height Seated (Max) 2.55mm
Width 27mm
RoHS Status ROHS3 Compliant
Просмотр сходства

SPC5676RDK3MVY1 Документы

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