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SVF331R3K1CKU2 Технические параметры

NXP USA Inc.  SVF331R3K1CKU2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Factory Lead Time 15 Weeks
Package / Case 176-LQFP Exposed Pad
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tray
Series Vybrid, VF3xxR
Published 2014
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 176Terminations
ECCN Code 5A002.A.1
Terminal Finish Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.23V
Time@Peak Reflow Temperature-Max (s) 40
Свойство продукта Значение свойства
JESD-30 Code S-PQFP-G176
Supply Voltage-Max (Vsup) 1.26V
Supply Voltage-Min (Vsup) 1.16V
Speed 266MHz, 133MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM® Cortex®-A5 + Cortex®-M4
Boundary Scan YES
Low Power Mode YES
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10/100Mbps (2)
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration No
RAM Controllers LPDDR2, DDR3, DRAM
USB USB 2.0 OTG + PHY (1)
Additional Interfaces CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Co-Processors/DSP Multimedia; NEON™ MPE
Security Features ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers DCU, GPU, LCD, VideoADC, VIU
RoHS Status ROHS3 Compliant
Просмотр сходства

SVF331R3K1CKU2 Документы

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