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FDG6308P Технические параметры
ON Semiconductor FDG6308P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Transistors - FETs, MOSFETs - Arrays | |
| Марка | ON Semiconductor | |
| Lifecycle Status | ACTIVE (Last Updated: 2 days ago) | |
| Factory Lead Time | 10 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-TSSOP, SC-88, SOT-363 | |
| Number of Pins | 6Pins | |
| Weight | 28mg | |
| Transistor Element Material | SILICON | |
| Number of Elements | 2 Elements | |
| Turn Off Delay Time | 7 ns | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Series | PowerTrench® | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| ECCN Code | EAR99 | |
| Resistance | 400MOhm | |
| Terminal Finish | Tin (Sn) | |
| Voltage - Rated DC | -20V | |
| Max Power Dissipation | 300mW | |
| Terminal Form | GULL WING |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Current Rating | -600mA | |
| Element Configuration | Dual | |
| Operating Mode | ENHANCEMENT MODE | |
| Power Dissipation | 300mW | |
| Turn On Delay Time | 5 ns | |
| FET Type | 2 P-Channel (Dual) | |
| Transistor Application | SWITCHING | |
| Rds On (Max) @ Id, Vgs | 400m Ω @ 600mA, 4.5V | |
| Vgs(th) (Max) @ Id | 1.5V @ 250μA | |
| Input Capacitance (Ciss) (Max) @ Vds | 153pF @ 10V | |
| Gate Charge (Qg) (Max) @ Vgs | 2.5nC @ 4.5V | |
| Rise Time | 15ns | |
| Drain to Source Voltage (Vdss) | 20V | |
| Fall Time (Typ) | 15 ns | |
| Continuous Drain Current (ID) | 600mA | |
| Gate to Source Voltage (Vgs) | 8V | |
| Drain to Source Breakdown Voltage | -20V | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| FET Feature | Logic Level Gate | |
| Height | 1mm | |
| Length | 2mm | |
| Width | 1.25mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
FDG6308P Документы
- PCN Design/SpecificationMold Compound 12/Dec/2007 Mold Compound 07/May/2008
- PCN Assembly/OriginMult Dev Assem/Material Chg 11/Mar/2019
- DatasheetsFDG6308P
- Environmental InformationMaterial Declaration FDG6308P
- PCN PackagingBinary Year Code Marking 15/Jan/2014 Mult Devices 24/Oct/2017
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