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ON Semiconductor LB1830M-E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | PMIC - Motor Drivers, Controllers | |
| Марка | ON Semiconductor | |
| Mounting Type | Surface Mount, Through Hole | |
| Contact Shape | Square | |
| Voltage, Rating | - | |
| Package | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | |
| Base Product Number | - | |
| Mated Stacking Heights | - | |
| Mfr | TE Connectivity Erni | |
| Product Status | Active | |
| Contact Materials | Copper Alloy | |
| Contact Finish Mating | Gold | |
| Insulation Materials | Liquid Crystal Polymer (LCP) | |
| Operating Temperature | -55°C ~ 125°C | |
| Series | MICROSPEED | |
| Termination | Solder | |
| Connector Type | Receptacle | |
| Number of Positions | 50Positions |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Applications | - | |
| Number of Rows | 2Rows | |
| Fastening Type | Push-Pull | |
| Contact Type | Female Socket | |
| Current Rating (Amps) | 1A | |
| Ingress Protection | - | |
| Insulation Height | 0.250 (6.35mm) | |
| Style | Board to Board | |
| Number of Positions Loaded | All | |
| Pitch - Mating | 0.039 (1.00mm) | |
| Insulation Color | Black | |
| Row Spacing - Mating | 0.059 (1.50mm) | |
| Contact Length - Post | - | |
| Contact Finish - Post | Tin | |
| Features | Board Guide, Pick and Place | |
| Contact Finish Thickness - Mating | - | |
| Contact Finish Thickness - Post | 157.5µin (4.00µm) | |
| Material Flammability Rating | UL94 V-0 |