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Q2240I-3S1 Технические параметры
Qualcomm Q2240I-3S1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Specialized ICs | |
| Марка | Qualcomm | |
| Surface Mount | YES | |
| Number of Terminals | 64Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | QUALCOMM | |
| Package Description | QFP, QFP64,.7X.95,40 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP64,.7X.95,40 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| JESD-609 Code | e0 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PQFP-G64 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| Supply Current-Max (Isup) | 0.1 mA |
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