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RPI3-MODBP-BULK Технические параметры
Raspberry Pi RPI3-MODBP-BULK technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Single Board Computers (SBCs) | |
| Марка | Raspberry Pi | |
| Package / Case | Axial | |
| Supplier Device Package | Axial | |
| Processor Brand | Broadcom | |
| Maximum RAM Capacity | 1 GB | |
| Maximum Operating Temperature | + 50 C | |
| Minimum Operating Temperature | 0 C | |
| Installed RAM | 1 GB | |
| Processor Type | BCM2837B0 | |
| Operating Temperature | -65°C ~ 175°C | |
| Series | Military, MIL-PRF-55182/07, RNC50 | |
| Packaging | Tape & Reel (TR) | |
| Size / Dimension | 0.070 Dia x 0.150 L (1.78mm x 3.81mm) | |
| Tolerance | ±1% |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Part Status | Active | |
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | ±100ppm/°C | |
| Resistance | 22.6 kOhms | |
| Composition | Metal Film | |
| Power (Watts) | 0.1W, 1/10W | |
| Frequency | 1.4 GHz | |
| Operating Supply Voltage | 5 V | |
| Failure Rate | P (0.1%) | |
| Core Architecture | ARM | |
| Form Factor | Raspberry Pi 3 B+ | |
| Features | Military, Moisture Resistant, Weldable | |
| Kit Contents | 150 Raspberry Pi 3 Model B+ boards only | |
| Height Seated (Max) | -- |
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