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UPD60802F1-A11-BND-E2-A Технические параметры

Renesas  UPD60802F1-A11-BND-E2-A technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Renesas
Mounting Type Panel Mount
Mounting Feature Bulkhead - Front Side Nut
Contact Shape Circular
Shell Material Aluminum Alloy
Insert Material Plastic
Lead Free Status / RoHS Status --
Contact Sizes 22D
Package Bulk
Mfr Renesas Electronics America Inc
Product Status Active
Operating Temperature -65°C ~ 200°C
Series MIL-DTL-38999 Series III, DTS
Packaging Bulk
Part Status Active
Moisture Sensitivity Level (MSL) --
Свойство продукта Значение свойства
Connector Type Receptacle Housing
Type For Male Pins
Number of Positions 128Positions
Fastening Type Threaded
Contact Type Crimp
Orientation D
Shielding Shielded
Ingress Protection Environment Resistant
Shell Finish Electroless Nickel
Shell Size - Insert 25-35
Housing Color Silver
Note Contacts Not Included
Shell Size, MIL --
Includes --
Features --
Material Flammability Rating --
UPD60802F1-A11-BND-E2-A brand manufacturers: Renesas, Anli stock, UPD60802F1-A11-BND-E2-A reference price.Renesas. UPD60802F1-A11-BND-E2-A parameters, UPD60802F1-A11-BND-E2-A Datasheet PDF and pin diagram description download.You can use the UPD60802F1-A11-BND-E2-A Embedded - System On Chip (SoC), DSP Datesheet PDF, find UPD60802F1-A11-BND-E2-A pin diagram and circuit diagram and usage method of function,UPD60802F1-A11-BND-E2-A electronics tutorials.You can download from the Anli.